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Review
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Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging
고집적 반도체 패키징을 위한 Seed 및 Seedless층 TSV의 Cu 충전 및 하이브리드 본딩
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Chae Yeon Lim, Shin Hui Seon, Hyun-Sik Kim, Jae Pil Jung
임채연, 선신희, 김현식, 정재필
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Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging
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Research Paper
- Layered and Polycrystalline Architectures of Boron Nitride Unveiled by Electron Microscopy
- Ankita Yadav, Mukesh Kumar, Ashutosh Sharma
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Research Paper
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Changes in Microstructure, Mechanical and Electrical Properties of Al-Fe-Mg-Cu-B System Aluminum Alloy Wire with Cold Drawing Process
인발공정에 따른 Al-Fe-Mg-Cu-B계 알루미늄합금 선재의 미세조직, 기계적 및 전기적 특성 변화
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Hyeon-Jun Heo, Handong Cho, Seong-Hee Lee
허현준, 조한동, 이성희
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Changes in Microstructure, Mechanical and Electrical Properties of Al-Fe-Mg-Cu-B System Aluminum Alloy Wire with Cold Drawing Process
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Research Paper
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Research Paper
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Changes in the Physical Properties of Polypropylene Resin by E-beam Irradiation
전자선 조사에 의한 폴리프로필렌 수지의 물리적 특성 변화
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Junghoo Lee, Yongseok Cho
이정후, 조용석
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Changes in the Physical Properties of Polypropylene Resin by E-beam Irradiation
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Research Paper
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Design of Conductive Network through the Hybrid Application of Super P and Multi-Walled Carbon Nanotube in Thick LiFePO4 Electrodes
LFP 후막전극에 Super P와 MWCNT의 복합 적용을 통한 전도성 네트워크 설계
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Hyeong-Rae Kim, Myeong-Hun Jo, Hyo-Jin Ahn
김형래, 조명훈, 안효진
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Design of Conductive Network through the Hybrid Application of Super P and Multi-Walled Carbon Nanotube in Thick LiFePO4 Electrodes
Journal Informaiton
Korean Journal of Materials Research
Korean Journal of Materials Research
Materials Research Society of Korea
한국재료학회
1611, 200, Wangsan-ro, Dongdaemun-gu, Seoul, Republic of Korea
Tel: +82-2-566-4496 / Fax: +82-2-566-4497 / E-mail: jmrs@mrs-k.or.kr Copyright© Materials Research Society of Korea. Powered by APUB
Tel: +82-2-566-4496 / Fax: +82-2-566-4497 / E-mail: jmrs@mrs-k.or.kr Copyright© Materials Research Society of Korea. Powered by APUB