Selective Atomic Layer Deposition of Co Thin Films Using Co(EtCp)2 Precursor

Sujeong Kim; Yong Tae Kim; Jaeyeong Heo

doi:10.3740/MRSK.2024.34.3.163

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2024 Vol.34, Issue 3 Preview Page Next Page

Research Paper

Selective Atomic Layer Deposition of Co Thin Films Using Co(EtCp)₂ Precursor Co(EtCp)₂프리커서를 사용한 Co 박막의 선택적 원자층 증착

27 March 2024. pp. 163-169

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Abstract

As the limitations of Moore’s Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO₂ hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO₂ composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)₂ precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO₂ substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

Keywords

Co(EtCp)₂

octadecyltrichlorosilane

selective deposition

atomic layer deposition

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Information

Publisher :Materials Research Society of Korea
Publisher(Ko) :한국재료학회
Journal Title :Korean Journal of Materials Research
Journal Title(Ko) :한국재료학회지
Volume : 34
No :3
Pages :163-169
Received Date : 2024-01-04
Revised Date : 2024-01-30
Accepted Date : 2024-01-30
DOI :https://doi.org/10.3740/MRSK.2024.34.3.163

Korean Journal of Materials Research 한국재료학회지 ISSN:1225-0562(Print) 2287-7258(Online)

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