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2019 Vol.29, Issue 11 Preview Page
Material and Structure Optimization of Substrate Support for Improving CVD Equipment Up Time

CVD 장비 Up Time 향상을 위한 기판 지지대의 재질 및 구조 최적화

Ram Woo1
,
Won Kyung Kim2†
우 람1
,
김 원경2†
1School of Nano Engineering, Inje University, Gimhae-si, Gyeongsangnam-do 50834, Republic of Korea
2School of Nano & Materials Science and Engineering, Kyungpook National University, Gyeongsangbuk-do 37224, Republic of Korea
1인제대학교 나노융합공학부
2경북대학교 나노소재공학부
†Corresponding author E-Mail : happ20@daum.net (W. K. Kim, Kyungpook Nat’l Univ.)
November 2019. pp. 670-676
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Abstract

We study substrate support structures and materials to improve uptime and shorten preventive maintenance cycles for chemical vapor deposition equipment. In order to improve the rolling of the substrate support, the bushing device adopts a ball transfer method in which a large ball and a small ball are mixed. When the main transfer ball of the bushing part of the substrate support contacts the substrate support, the small ball also rotates simultaneously with the rotation of the main ball, minimizing the resistance that can be generated during the vertical movement of the substrate support. As a result of the improvement, the glass substrate breakage rate is reduced by more than 90 ~ 95 %, and the equipment preventive maintenance and board support replacement cycles are extended four times or more, from once a month to more than four months, and the equipment uptime is at least 15 % improved. This study proposes an optimization method for substrate support structure and material improvement of chemical vapor deposition equipment.

Keywords
substrate support
chemical vapor deposition(CVD)
bushing
ball transfer
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Information
  • Publisher :Materials Research Society of Korea
  • Publisher(Ko) :한국재료학회
  • Journal Title :Korean Journal of Materials Research
  • Journal Title(Ko) :한국재료학회지
  • Volume : 29
  • No :11
  • Pages :670-676
  • Received Date : 2019-09-02
  • Revised Date : 2019-09-27
  • Accepted Date : 2019-09-27
  • DOI :https://doi.org/10.3740/MRSK.2019.29.11.670
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