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2024 Vol.34, Issue 11

Review

Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor

인공지능 반도체와 Through Glass Via 기술의 최근 동향 및 패키징 적용

Chul Hwa Jung1
,
Ji Won Park2
,
Sung Jin Kim3
,
Jae Pil Jung2†
정 철화1
,
박 지원2
,
김 성진3
,
정 재필2†
1Department of Intelligence Semiconductor, University of Seoul, Seoul 02504, Republic of Korea
2Department of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of Korea
3Ajin Electronics, Inc., Suwon 16648, Republic of Korea
1서울시립대학교 지능형반도체학과
2서울시립대학교 신소재공학과
3(주)아진전자
†Corresponding author E-Mail : jpjung@uos.ac.kr (J. P. Jung, Univ. Seoul)
27 November 2024. pp. 529-536
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Abstract

Semiconductors, optimized for artificial intelligence (AI) applications, are efficiently handling large-scale data processing and complex computations with high speed and low power consumption. They accelerate AI model training and inference in data centers, cloud services, autonomous vehicles, and mobile devices. As demand for high-speed data transmission and extensive data processing grows, global companies are developing proprietary AI semiconductors, and subsequently, high-density packaging technologies are needed to interconnect multiple processor chips. To achieve this, an interposer is required. An interposer is a layer used in packaging technology for combining multiple chips, which includes wiring that is inserted to electrically connect a semiconductor chip with a substrate that has a significant pitch difference. Among the materials employed as substrates or interposers, organic, silicon and glass are being considered. While silicon interposers are usually used to connect the main substrate and multiple chips, producing very thin silicon wafers and controlling warpage is challenging, and so they suffer from poor yield and integration. Also, organic substrates have difficulty achieving fine pitch because of their uneven surface and warpage. On the other hand, glass substrates and interposers have good electrical and thermal properties. For this reason, this study investigated AI semiconductor packaging trends and through glass via (TGV) technology, emphasizing the importance of suitable glass material selection, reliable glass-metal bonding and application to solder bumping on TGV. Advances in AI and TGV technologies are expected to drive next-generation AI semiconductor packaging development.

Keywords
through glass via
artificial intelligence
semiconductor
packaging
bumping
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Information
  • Publisher :Materials Research Society of Korea
  • Publisher(Ko) :한국재료학회
  • Journal Title :Korean Journal of Materials Research
  • Journal Title(Ko) :한국재료학회지
  • Volume : 34
  • No :11
  • Pages :529-536
  • Received Date : 2024-09-26
  • Revised Date : 2024-11-07
  • Accepted Date : 2024-11-08
  • DOI :https://doi.org/10.3740/MRSK.2024.34.11.529
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