Formation and Control of Dual Porous Structures of Metal by an Electrochemical Method

Seong-Hyeok Ha; Heon-Cheol Shin

doi:10.3740/MRSK.2019.29.2.65

All Issue

2019 Vol.29, Issue 2 Next Page

Formation and Control of Dual Porous Structures of Metal by an Electrochemical Method 전기화학적 방법을 통한 금속 이중기공구조 형성 및 제어

February 2019. pp. 65-72

PDF XML

Abstract

Dual porous structures are observed for the first time on a metallic Cu surface underneath anodic Cu oxide by the application of an anodizing voltage to Cu in oxalic acid. The as-prepared porous Cu surface contains macropores of less than 1 μm diameter and mesopores of about tens of nanometers diameter with circular shapes. The size and density (number of pores/area) of the macropores are dependent on the applied voltage. It is likely that the localized dissolution (corrosion) of Cu in oxalic acid under the anodizing voltages is responsible for the formation of the mesopores, and the combination of a number of the mesopores might create the macropores, especially under a relatively high anodizing voltages or a prolonged anodizing time. The variations of pore structure (especailly macropores) with applied voltage and time are reasonably explained on the basis of the proposed mechanism of pore formation.

Keywords

copper

porous structure

anodic oxidation

localized corrosion

oxalic acid

References

H.-C. Shin and M. Liu, Chem. Mater., 16, 5460 (2004).10.1021/cm048887b

J. Cabana, J. Monconduit, D. Larcher and M. R. Palacin, Adv. Mater., 22, E170 (2010).10.1002/adma.20100071720730811

M. Ahmad, J. Zhao, J. Iqbal, W. Miao, L. Xie, R. Mo and J. Zhu, J. Mater. Chem., 21, 7723 (2011).10.1039/c1jm10720h

D. H. Ha, M. A. Islam and R. D. Robinson, Nano Lett., 12, 5122 (2012).10.1021/nl301955922963404

Y. M. Chun and H. C. Shin, Electrochim. Acta, 209, 369 (2016).10.1016/j.electacta.2016.05.089

J. Vetter, P. Nova'k, M.R. Wagner, C. Veit, K.-C. Mőller, J.O. Besenhard, M. Winter, M. Wohlfahrt-Mehrens, C. Vogler and A. Hammouche, J. Power Sources, 147, 269 (2005).10.1016/j.jpowsour.2005.01.006

M. Wachtler, M. Winter and J. O. Besenhard, J. Power Sources, 105, 151 (2002).10.1016/S0378-7753(01)00934-X

H.-C. Shin, J. Dong and M. Liu, Adv. Mater., 15, 1610 (2003).10.1002/adma.200305160

K.-L. Lee, J.-Y. Jung, S.-W. Lee, H.-S. Moon and J.-W. Park, J. Power Sources, 129, 270 (2004).10.1016/j.jpowsour.2003.10.013

10.

R. H. Kim, D. W. Han, D. H. Nam, J. H. Kim and H. S. Kwon, J. Electrochem. Soc., 157, D269 (2010).10.1149/1.3356974

11.

Y. H. Rho, K. Kanamura, M. Fujisaki, J.-I. Hamagami, S.-I. Suda and T. Umegaki, Solid State Ionics, 151, 151 (2002).10.1016/S0167-2738(02)00594-5

12.

H. Duan, J. Gnanaraj, X. Chen, B. Li and J. Liang, J. Power Sources, 185, 512 (2008).10.1016/j.jpowsour.2008.06.078

13.

P. L. Taberna, S. Mitra, P. Poizot, P. Simon and J. M. Tarascon, Nat. Mater., 5, 567 (2006).10.1038/nmat167216783360

14.

M. H. Ryou, Y. M. Lee, Y. Lee, M. Winter and P. Bieker, Adv. Funct. Mater., 25, 834 (2015).10.1002/adfm.201402953

15.

J. L. Ord and D. J. DeSmet, J. Electrochem. Soc., 123, 1876 (1976).10.1149/1.2132715

16.

X. Zhou, G. E. Thompson, H. Habazaki, K. Shimizu, P. Skeldon and G. C. Wood, Thin Solid Films, 293, 327 (1997).10.1016/S0040-6090(96)09117-1

17.

S. Rudenja, J. Pan, I. Odnevall, C. Leygraf, P. Kulu, J. Electrochem. Soc., 146(11), 4082, (1999) 10.1149/1.1392595

18.

J. P. O'sullivan, and G. C. Wood, Proc. R. Soc. Lond. A, 317, 511 (1970).10.1098/rspa.1970.0129

19.

D. Gong, C. A. Grimes, O. K. Varghese, W. Hu, R. S. Singh, Z. Chen and E. C. Dickey, J. Mater. Res., 16, 3331 (2001).10.1557/JMR.2001.0457

20.

J.-W. Lee, S.-J. Park, W.-S. Choi, H.-C. Shin, Electrochim. Acta, 56, 5919 (2011).10.1016/j.electacta.2011.03.144

21.

G. E. Thompson, Thin Solid Films, 297, 192 (1997).10.1016/S0040-6090(96)09440-0

22.

K. Nielsch, J. Choi, K. Schwirn, R. B. Wehrspohn and U. Gosele, Nano Lett., 2, 677 (2002).10.1021/nl025537k

23.

S. H. Park, H. S. Shin, Y. H. Kim, H. M. Park and J. Y. Song, J. Alloys Compd., 580, 152 (2013).10.1016/j.jallcom.2013.05.130

Information

Publisher :Materials Research Society of Korea
Publisher(Ko) :한국재료학회
Journal Title :Korean Journal of Materials Research
Journal Title(Ko) :한국재료학회지
Volume : 29
No :2
Pages :65-72
Received Date : 2018-11-02
Revised Date : 2018-12-10
Accepted Date : 2018-11-30
DOI :https://doi.org/10.3740/MRSK.2019.29.2.65

Korean Journal of Materials Research ISSN:1225-0562(Print) 2287-7258(Online) 한국재료학회지

All Issue