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2020 Vol.30, Issue 1 Preview Page
Effect of Samarium Addition on Microstructure and Thermal Conductivity of Al-Si-Cu Aluminum Alloy

Sm 첨가에 따른 Al-Si-Cu 알루미늄 합금의 미세조직 및 열전도도 변화

Jin-Ju Choi1
,
Yubin Kang1
,
Byoungyong Im1
,
Chan-Gi Lee1
,
Hangoo Kim2
,
Kwang Hoon Park3
,
Dae-Guen Kim1†
최 진주1
,
강 유빈1
,
임 병용1
,
이 찬기1
,
김 한구2
,
박 광훈3
,
김 대근1†
1Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE), Yongin 17180, Republic of Korea
2NEDEC, Seongnam 13494, Republic of Korea
3Program in Metals and Materials Process Engineering, Inha University, Incheon 22212, Republic of Korea
1고등기술연구원
2㈜네덱
3인하대학교
†Corresponding author E-Mail : dgkim@iae.re.kr (D.-G. Kim, IAE)
January 2020. pp. 31-37
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Abstract

In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 μm were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

Keywords
Al-Si-Cu al alloy
rare earth
Sm
hardness
thermal conductivity
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Information
  • Publisher :Materials Research Society of Korea
  • Publisher(Ko) :한국재료학회
  • Journal Title :Korean Journal of Materials Research
  • Journal Title(Ko) :한국재료학회지
  • Volume : 30
  • No :1
  • Pages :31-37
  • Received Date : 2019-10-08
  • Revised Date : 2019-12-11
  • Accepted Date : 2019-12-11
  • DOI :https://doi.org/10.3740/MRSK.2020.30.1.31
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