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2024 Vol.34, Issue 10 Preview Page

Research Paper

Thermal Transport Properties of a Mixed Anion Layered Compound, Polycrystalline LaCu1-δS0.5Se0.5O (δ = 0.01)
Nobuhiko Azuma1†
,
Hiroki Sawada1
,
Hirotaka Ito1
,
Ryosuke Sakagami1
,
Yuya Tanaka1
,
Tatsuhide Fujioka1
,
Masanori Matoba12
,
Yoichi Kamihara12
1Department of Applied Physics and Physico-Informatics, Faculty of Science and Technology, Keio University, Yokohama 223-8552, Japan
2Center for Spintronics Research Network (CSRN), Keio University, Yokohama 223-8552, Japan
†Corresponding author E-Mail : ubon.mza@keio.jp (N. Azuma, Keio Univ.)
27 October 2024. pp. 464-474
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Abstract

Electrical and thermal transport properties of a polycrystalline carrier-doped wide-gap semiconductor LaCu1-δS0.5Se0.5O (δ = 0.01), in which the CuCh (Ch = S, Se) layer works as conducting layer, were measured at temperatures 473~673 K. The presence of δ = 0.01 copper defects dramatically reduces the electrical resistivity (ρ) to approximately one part per million compared to that of δ = 0 at room temperature. The polycrystalline δ = 0.01 sample exhibited ρ of 1.3 × 10-3 Ωm, thermal conductivity of 6.0 Wm-1 K-1, and Seebeck coefficient (S) of 87 µVK-1 at 673 K. The maximum value of the dimensionless figure of merit (ZT) of the δ = 0.01 sample was calculated to be 6.4 × 10-4 at T = 673 K. The ZT value is far smaller than a ZT ~ 0.01 measured for a nominal LaCuSeO sample. The smaller ZT is mainly due to the small S measured for LaCu1-δS0.5Se0.5O (δ = 0.01). According to the Debye model, above 300 K phonon thermal conductivity in a pure lattice is inversely proportional to T, while thermal conductivity of the δ = 0.01 sample increases with increasing T.

Keywords
thermoelectric material
mixed anion layered compounds
Cu defect
LaCu1-δS0.5Se0.5O
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Information
  • Publisher :Materials Research Society of Korea
  • Publisher(Ko) :한국재료학회
  • Journal Title :Korean Journal of Materials Research
  • Journal Title(Ko) :한국재료학회지
  • Volume : 34
  • No :10
  • Pages :464-474
  • Received Date : 2024-08-19
  • Revised Date : 2024-09-24
  • Accepted Date : 2024-09-25
  • DOI :https://doi.org/10.3740/MRSK.2024.34.10.464
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