All Issue

2023 Vol.33, Issue 12 Preview Page

Research Paper

Factors Influencing the Camber of Cofired Resistor/Low Temperature Cofired Ceramics (LTCC) Bi-Layers

동시 소성된 저항/저온 동시 소성 세라믹(LTCC) 이중층의 캠버에 영향을 미치는 인자

Ok Yeon Hong1
,
Seok-Hong Min2†
홍 옥연1
,
민 석홍2†
1R&D Team, RN2 Technologies, Gangneung 25451, Republic of Korea
2Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 25457, Republic of Korea
1(주)알엔투테크놀로지 개발팀
2강릉원주대학교 신소재금속공학과
†Corresponding author E-Mail : shmin@gwnu.ac.kr (S.-H. Min, Gangneung-Wonju Nat’l Univ.)
27 December 2023. pp. 537-549
PDF XML Citation
Abstract

The sintering shrinkage behaviors of low temperature cofired ceramics (LTCC) and resistors were compared using commercial LTCC and thick-film resistor pastes, and factors influencing the camber of cofired resistor/LTCC bi-layers were also investigated. The onset of sintering shrinkage of the resistor occurred earlier than that of LTCC in all resistors, but the end of sintering shrinkage of the resistor occurred earlier or later than that of LTCC depending on the composition of the resistor. The sintering shrinkage end temperature and the sintering shrinkage temperature interval of the resistor increased as the RuO2/glass volume ratio of the resistor increased. The camber of cofired resistor/LTCC bi-layers was obtained using three different methods, all of which showed nearly identical trends. The camber of cofired resistor/LTCC bi-layers was not affected by either the difference in linear shrinkage strain after sintering between LTCC and resistors or the similarity of sintering shrinkage temperature ranges of LTCC and resistors. However, it was strongly affected by the RuO2/glass volume ratio of the resistor. The content of Ag and Pd had no effect on the sintering shrinkage end temperature or sintering shrinkage temperature interval of the resistor, or on the camber of cofired resistor/LTCC bi-layers.

Keywords
low temperature cofired ceramics
thick film resistor
sintering shrinkage behavior
cofiring
camber
References
1
H. Birol, T. Maeder, C. Jacq and P. Ryser, J. Eur. Ceram. Soc., 25, 2065 (2005). 10.1016/j.jeurceramsoc.2005.03.182
2
G. Q. Lu, R. C. Sutterlin and T. K. Gupta, J. Am. Ceram. Soc., 76, 1907 (1993). 10.1111/j.1151-2916.1993.tb08311.x
3
J. H. Jean and C. R. Chang, J. Am. Ceram. Soc., 80, 3084 (1997). 10.1111/j.1151-2916.1997.tb03236.x
4
C. R. Chang and J. H. Jean, J. Am. Ceram. Soc., 81, 2805 (1998). 10.1111/j.1151-2916.1998.tb02700.x
5
C. J. Ting, C. S. Hsi and H. Y. Lu, J. Am. Ceram. Soc., 83, 2945 (2000). 10.1111/j.1151-2916.2000.tb01665.x
6
C. S. Hsi and M. W. Lee, Jpn. J. Appl. Phys., 41, 5323 (2002). 10.1143/JJAP.41.5323
7
J. H. Jean and C. R. Chang, J. Am. Ceram. Soc., 87, 1287 (2004). 10.1111/j.1151-2916.2004.tb07724.x
8
H. Birol, T. Maeder and P. Ryser, 1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) (Baltimore, MD, April 2005), p.300.
9
R. C. Sutterlin, G. O. Dayton and J. V. Biggers, IEEE Trans. Compon., Packag., Manuf. Technol., Part B, 18, 346 (1995). 10.1109/96.386272
10
P. Z. Cai, G. L. Messing and D. L. Green, J. Am. Ceram. Soc., 80, 1929 (1997). 10.1111/j.1151-2916.1997.tb03075.x
11
P. Z. Cai, G. L. Messing and D. L. Green, J. Am. Ceram. Soc., 80, 1940 (1997). 10.1111/j.1151-2916.1997.tb03076.x
12
J. Kanters, U. Eisele and J. Rodel, J. Am. Ceram. Soc., 84, 2757 (2001). 10.1111/j.1151-2916.2001.tb01091.x
13
M. J. Chiang, J. H. Jean and S. C. Lin, Mater. Chem. Phys., 28, 413 (2011). 10.1016/j.matchemphys.2011.03.020
14
D. W. Ni, V. Esposito, C. G. Schmidt, T. T. Molla, K. B. Andersen, A. Kaiser, S. Ramousse and N. Pryds, J. Am. Ceram. Soc., 96, 972 (2013). 10.1111/jace.12113
15
Z. Ma, S. Qi and R. Zuo, Ceram. Int., 42, 7164 (2016). 10.1016/j.ceramint.2016.01.106
16
R, Huang and J. Pan, J. Eur. Ceram. Soc., 28, 1931 (2008). 10.1016/j.jeurceramsoc.2008.01.016
17
L. Chrétien, A. Heux, G. Antou, N. Pradeilles, N. Delhote and A. Maître, Materials, 15, 6405 (2022). 10.3390/ma1518640536143721PMC9503680
18
J. S. Sung, K. D. Koo, C. K. Yoon, S. J. Lee and J. H. Park, J. Korean Ceram. Soc., 34, 601 (1997).
19
G. Feng, Y. Zupei, H. Yudong, T. Changsheng and Q. Shaobo, J. Mater. Sci., 38, 1523 (2003). 10.1023/A:1022932817200
20
X. Liu, Bull. Mater. Sci., 37, 117 (2014). 10.1007/s12034-014-0632-y
21
S. Vasudevan and A. Shaikh, Proceedings of 44th Electronic Components and Technology Conference (Washington, DC, May 1994) p.612.
22
H. Birol, T. Maeder and P. Ryser, J. Eur. Ceram. Soc., 26, 1937 (2006). 10.1016/j.jeurceramsoc.2005.09.030
23
S. M. Chitale and R. W. Vest, IEEE Trans. Compon., Hybrids, Manuf. Technol., 11, 604 (1988). 10.1109/TCHMT.1988.1134934
24
Y. M. Chiang, L. A. Silverman, R. H. French and R. M. Cannon, J. Am. Ceram. Soc., 77, 1143 (1994). 10.1111/j.1151-2916.1994.tb05386.x
25
T. Ogihara and T. Kodera, Mater. Trans., 61, 1409 (2020). 10.2320/matertrans.MT-M2019365
26
Y. Imanaka, Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, p.87, Springer, New York, NY (2005).
27
S. Inaba and S. Fujino, J. Am. Ceram. Soc., 93, 217 (2010). 10.1111/j.1551-2916.2009.03363.x
28
J. W. Oh, S. K. Ryu, W. S. Lee and S. J. Park, Powder Technol., 322, 1 (2017). 10.1016/j.powtec.2017.08.055
29
N. Rodkevich E. Glazkova, A. Pervikov, Marat Lerner and S. Kazantsev, AIP Conf. Proc., 2051, 020252 (2018). 10.1063/1.5083495
30
O. R. K. Montedo, F. J. Floriano, J. O. Filho, E. Angoletto and A. M. Bernardin, Mater. Res., 12, 197 (2009). 10.1590/S1516-14392009000200014
31
L. Lefebvre, L. Gremillard, J. Chevalier, R. Zenati and D. Bernache-Assolant, Acta Biomater., 4, 1894 (2008). 10.1016/j.actbio.2008.05.01918583208
32
J. Marchi, J. C. Bressiani and A. H. A. Bressiani, Mater. Res., 4, 231 (2001). 10.1590/S1516-14392001000400002
33
A. Karamanov and M Pelino, J. Eur. Ceram. Soc., 26, 2519 (2006). 10.1016/j.jeurceramsoc.2005.12.007
34
O. R. K. Montedo, F. J. Floriano, J. O. Filho, E. Angoletto and A. M. Bernardin, Mater. Res., 12, 197 (2009). 10.1590/S1516-14392009000200014
35
F. Andreola, L. Barbieri, I. Lancellotti, M. I. Martín, J. Ma. Rincón and M. Romero, J. Therm. Anal. Calorim., 123, 241 (2016). 10.1007/s10973-015-4960-y
36
A. N. Prabhu and R. W. Vest, Sintering and Catalysis, Materials Science Research, vol 10, p.399, ed. G. C. Kuczynski, Springer, Boston, MA (1975). 10.1007/978-1-4684-0934-5_30
37
B. S. Chiou and J. Y. Sheu, J. Electron. Mater., 21, 575 (1992). 10.1007/BF02655423
38
R. W. Vest, IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, 396 (1991). 10.1109/33.87321
39
H. M. Cho, H. J. Kim, C. S. Lee, K. S. Bang and N. K. Kang, J. Microelectron. Packag. Soc., 11, 77 (2004).
40
R. K. Bordia and G. W. Scherer, Acta Metall., 36, 2399 (1988). 10.1016/0001-6160(88)90190-3
41
J. Ollagnier, O. Guillon and J. Rödel, J. Am. Ceram. Soc., 93, 74 (2010). 10.1111/j.1551-2916.2009.03346.x
42
H. L. Frandsen, E. Olevsky, T. T. Molla, V. Esposito, R. Bjørk and N. Pryds, J. Am. Ceram. Soc., 96, 80 (2013). 10.1111/jace.12070
43
P. Jaccard, New Phytol., 11, 37 (1912). 10.1111/j.1469-8137.1912.tb05611.x
Information
  • Publisher :Materials Research Society of Korea
  • Publisher(Ko) :한국재료학회
  • Journal Title :Korean Journal of Materials Research
  • Journal Title(Ko) :한국재료학회지
  • Volume : 33
  • No :12
  • Pages :537-549
  • Received Date : 2023-10-09
  • Revised Date : 2023-10-25
  • Accepted Date : 2023-12-04
  • DOI :https://doi.org/10.3740/MRSK.2023.33.12.537
Journal Informaiton Korean Journal of Materials Research Korean Journal of Materials Research
Online Submission
  • scopus
  • NRF
  • KOFST
  • crossref crossmark
  • crossref cited-by
  • crosscheck
  • open access
  • ccl
Journal Informaiton Journal Informaiton - close