Reactivity Evaluation on Copper Etching Using Organic Chelators

Chul Hee Kim; Eun Taek Lim; Chan Ho Park; Sung Yong Park; Ji Soo Lee; Chee Won Chung; Dong Wook Kim

doi:10.3740/MRSK.2021.31.10.569

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Reactivity Evaluation on Copper Etching Using Organic Chelators 유기 킬레이터들을 이용한 구리 식각에 대한 반응성 평가

October 2021. pp. 569-575

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Abstract

The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

Keywords

copper

chelator

ethylenediamine

piperidine

aminoethanol

References

A. Jain, T. T. Kodas and M. J. Hampden-Smith, Thin Solid Films, 269, 51 (1995). 10.1016/0040-6090(95)06877-5

M. T. Bohr, Solid State Technol., 39, 105 (1996).

S. Lee and Y. Kuo, Thin Solid Films, 457, 326 (2004). 10.1016/j.tsf.2003.10.011

T. S. Choi, G. Levitin and D. W. Hess, ECS J. Solid State Sci. Technol., 2, 506 (2013). 10.1149/2.002312jss

S. Lee and Y. Kuo, J. Electrochem. Soc., 148, G524 (2001). 10.1149/1.1392324

P. A. Tamirisa, G. Levitin, N. S. Kulkarni and D. W. Hess, Microelectron. Eng., 84, 105 (2007). 10.1016/j.mee.2006.08.012

F. Wu, G. Levitin and D. W. Hess, ACS Appl. Mater. Interfaces, 2, 2175 (2010). 10.1021/am1003206

S. M. Rossnagel and T. S. Kuan, J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom., 22, 240 (2004). 10.1116/1.1642639

W. Zhang, S. H. Brongersma, N. Heylen, G. Beyer, W. Vandervorst and K. Maex, J. Electrochem. Soc., 152, C832 (2005). 10.1149/1.2109507

10.

F. Wu, G. Levitin and D. W. Hess, J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom., 29, 011013 (2011). 10.1116/1.3520461

11.

B. J. Howard and C. Steinbrüchel, Appl. Phys. Lett., 59, 914 (1991). 10.1063/1.106299

12.

K. Ohno, M. Sato and Y. Arita, J. Electrochem. Soc., 143, 4089 (1996). 10.1149/1.1837341

13.

J. W. Lee, Y. D. Park, J. R. Childress, S. J. Pearton, F. Shariff and F. Ren, J. Electrochem. Soc., 145, 2585 (1998). 10.1149/1.1838685

14.

M. S. Kwon and J. Y. Lee, J. Electrochem. Soc., 146, 3119 (1999). 10.1149/1.1392441

15.

S. W. Kang, H. U. Kim and S. W. Rhee, J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom., 17, 154 (1999). 10.1116/1.590528

16.

F. Wu, G. Levitin and D. W. Hess, J. Electrochem. Soc., 159, H121 (2011). 10.1149/2.015202jes

17.

E. T. Lim, J. S. Ryu and C. W. Chung, Thin Solid Films, 665, 51 (2018). 10.1016/j.tsf.2018.08.046

18.

E. T. Lim, J. S. Ryu, J. S. Choi and C. W. Chung, Vacuum, 167, 145 (2019). 10.1016/j.vacuum.2019.05.046

19.

J. S. Ryu, E. T. Lim, J. S. Choi and C. W. Chung, Thin Solid Films, 672, 55 (2019). 10.1016/j.tsf.2018.12.042

Information

Publisher :Materials Research Society of Korea
Publisher(Ko) :한국재료학회
Journal Title :Korean Journal of Materials Research
Journal Title(Ko) :한국재료학회지
Volume : 31
No :10
Pages :569-575
Received Date : 2021-08-05
Revised Date : 2021-09-30
Accepted Date : 2021-10-05
DOI :https://doi.org/10.3740/MRSK.2021.31.10.569

Korean Journal of Materials Research ISSN:1225-0562(Print) 2287-7258(Online) 한국재료학회지

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