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2012 Vol.22, Issue 7 Preview Page
Formation of Copper Seed Layers and Copper Via Filling with Various Additives

Copper Seed Layer 형성 및 도금 첨가제에 따른 Copper Via Filling

이현주, 김양도, 지창욱, 우성민, 최만호, 황윤회, 이재호
July 2012. pp. 335~341
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Information
  • Publisher :Materials Research Society of Korea
  • Publisher(Ko) :한국재료학회
  • Journal Title :Korean Journal of Materials Research
  • Journal Title(Ko) :한국재료학회지
  • Volume : 22
  • No :7
  • Pages :335~341
  • DOI :https://doi.org/10.3740/MRSK.2012.22.7.335
Journal Informaiton Korean Journal of Materials Research Korean Journal of Materials Research
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