• Review

    Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging

    고집적 반도체 패키징을 위한 Seed 및 Seedless층 TSV의 Cu 충전 및 하이브리드 본딩

    Chae Yeon Lim, Shin Hui Seon, Hyun-Sik Kim, Jae Pil Jung

    임채연, 선신희, 김현식, 정재필

    Through-silicon via (TSV) filling is indispensable for three-dimensional semiconductor packaging. Conventional processes rely on PVD (physical vapor deposition) or ALD (atomic layer … + READ MORE
    Through-silicon via (TSV) filling is indispensable for three-dimensional semiconductor packaging. Conventional processes rely on PVD (physical vapor deposition) or ALD (atomic layer deposition) seed layer deposition followed by copper electroplating, but these approaches face limitations in productivity and conformality. ALD and ELD (electroless deposition) have been investigated as seed-based approaches to overcome poor step coverage, while seedless strategies have also been proposed including additive-assisted electroplating, electroless alloy layers, metallic nanowires, and conductive pastes. These methods have demonstrated void-free or seam-free fills under specific conditions, yet challenges remain in achieving uniform superconformal filling across dense arrays, suppressing copper oxidation and interfacial contamination during rinsing/drying, and guaranteeing long-term reliability under thermomechanical cycling, electromigration, and humidity bias. In parallel, hybrid bonding has emerged as an alternative to thermo-compression bonding, where TSV filling performance, CMP (chemical mechanical polishing) planarization, and interface activation are crucial to reliable bonding. An integrated research approach incorporating both seed- and seedless-based TSV filling together with hybrid bonding provides a credible pathway to reliable three-dimensional stacking for high-bandwidth memory and artificial intelligence applications. - COLLAPSE
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    27 November 2025

  • Research Paper

    Layered and Polycrystalline Architectures of Boron Nitride Unveiled by Electron Microscopy
    Ankita Yadav, Mukesh Kumar, Ashutosh Sharma
    This study thoroughly examines boron nitride (BN) materials prepared through solid-state synthesis using a multiscale characterization approach to understand their structural, morphological, … + READ MORE
    This study thoroughly examines boron nitride (BN) materials prepared through solid-state synthesis using a multiscale characterization approach to understand their structural, morphological, and functional attributes. These attributes are crucial for gas sensing applications. Scanning electron microscopy (SEM) revealed a flake-like, layered surface structure typical of hexagonal BN, indicating well-developed crystallites and interlayer alignment. Further insights from transmission electron microscopy (TEM) and selected area electron diffraction (SAED) confirmed the polycrystalline nature of the BN nanostructures and uncovered details such as nanosheet stacking, interplanar spacing, and local distortions such as surface wrinkling and folding. These nanoscale textural features improve the surface roughness and porosity, which are beneficial for gas adsorption and surface reactivity. Together, these imaging and diffraction results (SEM, TEM and SAED) suggest a uniform structural framework with a high surface area and excellent thermal and chemical stability. Such properties highlight the suitability of BN materials for advanced applications in thermal management, electrical insulation, and gas sensing systems. - COLLAPSE
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    27 November 2025

  • Research Paper

    Changes in Microstructure, Mechanical and Electrical Properties of Al-Fe-Mg-Cu-B System Aluminum Alloy Wire with Cold Drawing Process

    인발공정에 따른 Al-Fe-Mg-Cu-B계 알루미늄합금 선재의 미세조직, 기계적 및 전기적 특성 변화

    Hyeon-Jun Heo, Handong Cho, Seong-Hee Lee

    허현준, 조한동, 이성희

    The Al-Fe-Mg-Cu-B system aluminum alloy is used for electrical wire, but is severely deformed by the multi-pass drawing process when a rod … + READ MORE
    The Al-Fe-Mg-Cu-B system aluminum alloy is used for electrical wire, but is severely deformed by the multi-pass drawing process when a rod with a diameter of 12 mm is greatly reduced to 2.0 mm. This study investigated the changes in the microstructure, mechanical properties, and electrical properties of the aluminum wire during the drawing process in detail. The as-drawn aluminum alloy wire exhibited a deformation structure in which the grains were greatly elongated in the drawing direction, particularly in the specimens subjected to more than 80 % reduction in cross-sectional area (RA). For all drawn specimens, the fiber texture of the {110}<111> and {112}<111> components was mainly developed. The hardness tended to increase with increasing RA due to work hardening. In particular, when the RA increased to 97 % a great increase in hardness resulted. The specimen with an RA of 97 % showed the highest tensile strength of 288 MPa, 2.2 times higher than that of the specimen before drawing. The electrical conductivity decreased slightly with increasing RA, even in specimens with extreme increases in RA, and it remained at an average value of 56.6 %IACS. - COLLAPSE
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    27 November 2025

  • Research Paper

    Electrohydrodynamic Instability-Induced Surface Structuring of Poly(vinylidene fluoride-trifluoroethylene) Films for Enhanced Dielectric Performance

    전기수력 불안정성을 이용한 PVDF-TrFE 박막의 표면 구조체 형성 및 유전 특성 향상

    Dongseong Lee, Hyunje Park

    이동성, 박현제

    Poly(vinylidene fluoride-trifluoroethylene) (PVDF-TrFE) is a promising ferroelectric polymer for flexible electronics and energy-harvesting devices, owing to its high piezoelectric coefficient and mechanical … + READ MORE
    Poly(vinylidene fluoride-trifluoroethylene) (PVDF-TrFE) is a promising ferroelectric polymer for flexible electronics and energy-harvesting devices, owing to its high piezoelectric coefficient and mechanical flexibility. Here, we report that electrohydrodynamic instability induces the formation of closely packed nanostructures on PVDF-TrFE thin film. Intriguingly, the strong electric field used in the fabrication process drives the polymeric fluid of PVDF-TrFE upwards to form the surface structures, facilitating molecular dipole alignment and crystalline ordering. This effect contributes to improved crystal alignment, as confirmed by enhanced X-ray diffraction and Raman characteristic peaks. The nanostructured PVDF-TrFE films exhibit enhanced dielectric properties including permittivity, dielectric loss, and ferroelectric polarization. Notably, P-E loop measurements showed a larger remnant polarization and higher saturation polarization in the nanostructured PVDF-TrFE films, indicating improved ferroelectric behavior. Our results suggest that the electrohydrodynamic instability provides a simple but effective route to simultaneously tailor the surface morphology, crystalline phase, and electrical performance of PVDF-TrFE films. - COLLAPSE
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    27 November 2025

  • Research Paper

    Changes in the Physical Properties of Polypropylene Resin by E-beam Irradiation

    전자선 조사에 의한 폴리프로필렌 수지의 물리적 특성 변화

    Junghoo Lee, Yongseok Cho

    이정후, 조용석

    This study investigates the effects of electron beam irradiation (0-125 kGy) on the physical properties of polypropylene (PP) resin. Changes in thermal … + READ MORE
    This study investigates the effects of electron beam irradiation (0-125 kGy) on the physical properties of polypropylene (PP) resin. Changes in thermal stability and crystallinity were analyzed using DSC and TGA, while FT-IR confirmed the introduction of polar groups and structural modifications. Colorimetric analysis (CIE-Lab) demonstrated that the color difference (∆E) and yellowing index (YI) increased progressively with irradiation dose, corresponding to the formation of oxidized chromophoric species. Gel Permeation Chromatography (GPC) and Gas Chromatography–Mass Spectrometry (GC-MS) revealed a clear reduction in molecular weight and the formation of low-molecular volatile compounds, providing direct evidence of chain scission processes. Contact angle measurements showed that electron beam treatment altered surface energy and wettability, reflecting a transition from non-polar to moderately polar surface characteristics. Overall, electron beam irradiation induces simultaneous molecular and physical changes in PP, influencing its heat resistance, mechanical integrity, color stability, and surface properties. These findings contribute to a deeper understanding of radiation-induced polymer modification and highlight the potential of controlled electron beam processing as an effective method for tailoring the structure and functionality of polyolefin-based materials for advanced industrial applications. - COLLAPSE
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    27 November 2025

  • Research Paper

    Design of Conductive Network through the Hybrid Application of Super P and Multi-Walled Carbon Nanotube in Thick LiFePO4 Electrodes

    LFP 후막전극에 Super P와 MWCNT의 복합 적용을 통한 전도성 네트워크 설계

    Hyeong-Rae Kim, Myeong-Hun Jo, Hyo-Jin Ahn

    김형래, 조명훈, 안효진

    Enhancing the energy density of electrodes by increasing thickness and mass loading is a technological challenge. Thick electrodes suffer from severe deterioration … + READ MORE
    Enhancing the energy density of electrodes by increasing thickness and mass loading is a technological challenge. Thick electrodes suffer from severe deterioration in electrochemical performance due to insufficient structural integrity and sluggish charge transport, particularly under high current density. Herein, we fabricated thick LiFePO4 (LFP) electrodes with thicknesses ranging from 85.7 to 90.3 µm and an average mass loading of 17.68 mg/cm2 by tailoring the ratio of zero-dimensional (Super P, SP) and one-dimensional (multi-walled carbon nanotube, MWCNT) conductive additives. The electrodes containing MWCNT exhibited crack-free structure and enhanced electrochemical performance with increasing MWCNT ratio because of the superior mechanical properties and electrical conductivity of MWCNT. However, the electrochemical performance of the electrode containing only MWCNT deteriorated due to aggregation of the MWCNT and poor point to point contact with the LFP particles. The multi-dimensional conductive additives improve the dispersion of components within the electrode and the structural stability of the electrode. As a result, the tailored electrode exhibited a lower degree of electrode thickness expansion (1.4 %), lower polarization (60.8 mV at 0.1 C), excellent high-rate capability (132.7 mAh/g at 2 C), superior capacity retention (27.5 % at 3 C), and lower electrical resistivity and interfacial resistance (14.9 Ω cm and 3.8 Ω cm2, respectively) compared to other samples. - COLLAPSE
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    27 November 2025
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Journal Informaiton Korean Journal of Materials Research Korean Journal of Materials Research
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