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ISSN : 1225-0562(Print)
ISSN : 2287-7258(Online)
Korean Journal of Materials Research Vol.30 No.1 pp.31-37

Effect of Samarium Addition on Microstructure and Thermal Conductivity of Al-Si-Cu Aluminum Alloy

Jin-Ju Choi1, Yubin Kang1, Byoungyong Im1, Chan-Gi Lee1, Hangoo Kim2, Kwang Hoon Park3, Dae-Guen Kim1†
1Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE), Yongin 17180, Republic of Korea
2NEDEC, Seongnam 13494, Republic of Korea
3Program in Metals and Materials Process Engineering, Inha University, Incheon 22212, Republic of Korea
Corresponding author E-Mail : (D.-G. Kim, IAE)


In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 μm were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

Sm 첨가에 따른 Al-Si-Cu 알루미늄 합금의 미세조직 및 열전도도 변화

최진주1, 강유빈1, 임병용1, 이찬기1, 김한구2 , 박광훈3, 김대근1†
1고등기술연구원, 2㈜네덱, 3인하대학교